Manufacturing
Key production processes at the factory of ModuleTek, the brand we carry. From SMT assembly through COB (chip-on-board) to optical sub-assembly and sealing, an in-house manufacturing flow ensures quality.
Surface Mount (SMT)
High-precision placement of tiny components onto the PCB.
Mounting Process
Mounting optical components into their designated positions.
AOI Inspection
Automated optical inspection of every assembled board.
Laser Depaneling
Stress-free separation of boards using laser depaneling.
Die Bonding
Precisely bonding the optical die onto its carrier.
Gold Wire Ball Bonding
Forming electrical interconnects with gold wire bonding.
Laser Welding
High-strength joining of optical sub-assemblies (OSA).
Sealing Process
Hermetic sealing of the device for long-term reliability.